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1. product pro?le 1.1 general description planar maximum ef?ciency general application (mega) schottky barrier recti?ers with an integrated guard ring for stress protection, encapsulated in small surface-mounted device (smd) plastic packages. 1.2 features n forward current: i f 1a n reverse voltage: v r 20 v n very low forward voltage n small smd plastic packages 1.3 applications n low voltage recti?cation n high ef?ciency dc-to-dc conversion n switch mode power supply n reverse polarity protection n low power consumption applications 1.4 quick reference data [1] pulse test: t p 300 m s; d 0.02. pmeg2010eh; pmeg2010ej; PMEG2010ET 1 a very low v f mega schottky barrier recti?ers rev. 04 20 march 2007 product data sheet table 1. product overview type number package con?guration nxp jeita jedec pmeg2010eh sod123f - - single pmeg2010ej sod323f sc-90 - single PMEG2010ET sot23 - to-236ab single table 2. quick reference data symbol parameter conditions min typ max unit i f forward current t sp 55 c --1a v r reverse voltage - - 20 v v f forward voltage i f = 1000 ma [1] - 420 500 mv
pmeg2010eh_ej_et_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 20 march 2007 2 of 11 nxp semiconductors pmeg2010eh/ej/et 1 a very low v f mega schottky barrier recti?ers 2. pinning information [1] the marking bar indicates the cathode. 3. ordering information 4. marking [1] * = -: made in hong kong * = p: made in hong kong * = t: made in malaysia * = w: made in china table 3. pinning pin description simpli?ed outline symbol sod123f; sod323f 1 cathode [1] 2 anode sot23 1 anode 2 n.c. 3 cathode 001aab540 12 sym001 12 12 3 006aaa436 1 3 2 n.c. table 4. ordering information type number package name description version pmeg2010eh - plastic surface-mounted package; 2 leads sod123f pmeg2010ej sc-90 plastic surface-mounted package; 2 leads sod323f PMEG2010ET - plastic surface-mounted package; 3 leads sot23 table 5. marking codes type number marking code [1] pmeg2010eh a9 pmeg2010ej ah PMEG2010ET *au
pmeg2010eh_ej_et_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 20 march 2007 3 of 11 nxp semiconductors pmeg2010eh/ej/et 1 a very low v f mega schottky barrier recti?ers 5. limiting values [1] device mounted on an fr4 printed-circuit board (pcb), single-sided copper, tin-plated and standard footprint. [2] device mounted on an fr4 pcb, single-sided copper, tin-plated, mounting pad for cathode 1 cm 2 . table 6. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v r reverse voltage - 20 v i f forward current t sp 55 c-1a i frm repetitive peak forward current t p 1 ms; d 0.25 pmeg2010eh - 7 a pmeg2010ej - 7 a PMEG2010ET - 5 a i fsm non-repetitive peak forward current square wave; t p =8ms -9a p tot total power dissipation t amb 25 c pmeg2010eh [1] - 375 mw [2] - 830 mw pmeg2010ej [1] - 350 mw [2] - 830 mw PMEG2010ET [1] - 280 mw [2] - 420 mw t j junction temperature - 150 c t amb ambient temperature - 65 +150 c t stg storage temperature - 65 +150 c
pmeg2010eh_ej_et_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 20 march 2007 4 of 11 nxp semiconductors pmeg2010eh/ej/et 1 a very low v f mega schottky barrier recti?ers 6. thermal characteristics [1] for schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses p r are a signi?cant part of the total power losses. [2] device mounted on an fr4 pcb, single-sided copper, tin-plated and standard footprint. [3] device mounted on an fr4 pcb, single-sided copper, tin-plated, mounting pad for cathode 1 cm 2 . [4] soldering point of cathode tab. 7. characteristics [1] pulse test: t p 300 m s; d 0.02. table 7. thermal characteristics symbol parameter conditions min typ max unit r th(j-a) thermal resistance from junction to ambient in free air [1] pmeg2010eh [2] - - 330 k/w [3] - - 150 k/w pmeg2010ej [2] - - 350 k/w [3] - - 150 k/w PMEG2010ET [2] - - 440 k/w [3] - - 300 k/w r th(j-sp) thermal resistance from junction to solder point [4] pmeg2010eh - - 60 k/w pmeg2010ej - - 55 k/w PMEG2010ET - - 120 k/w table 8. characteristics t amb =25 c unless otherwise speci?ed. symbol parameter conditions min typ max unit v f forward voltage [1] i f = 0.1 ma - 90 130 mv i f = 1 ma - 150 190 mv i f = 10 ma - 210 240 mv i f = 100 ma - 280 330 mv i f = 500 ma - 355 390 mv i f = 1000 ma - 420 500 mv i r reverse current v r =10v - 15 40 m a v r = 20 v - 40 200 m a c d diode capacitance v r =1v; f=1mhz - 6680pf
pmeg2010eh_ej_et_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 20 march 2007 5 of 11 nxp semiconductors pmeg2010eh/ej/et 1 a very low v f mega schottky barrier recti?ers (1) t amb = 150 c (2) t amb = 125 c (3) t amb =85 c (4) t amb =25 c (5) t amb = - 40 c (1) t amb = 150 c (2) t amb = 125 c (3) t amb =85 c (4) t amb =25 c (5) t amb = - 40 c fig 1. forward current as a function of forward voltage; typical values fig 2. reverse current as a function of reverse voltage; typical values f = 1 mhz; t amb =25 c fig 3. diode capacitance as a function of reverse voltage; typical values 006aaa247 1 10 - 1 10 2 10 10 3 i f (ma) 10 - 2 v f (v) 0 0.5 0.4 0.2 0.3 0.1 (1) (2) (3) (4) (5) 006aaa248 i r ( m a) 1 10 - 2 10 - 1 10 4 10 3 10 2 10 10 5 10 - 3 v r (v) 020 16 812 4 (1) (2) (3) (4) (5) v r (v) 020 16 812 4 006aaa249 40 80 120 c d (pf) 0
pmeg2010eh_ej_et_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 20 march 2007 6 of 11 nxp semiconductors pmeg2010eh/ej/et 1 a very low v f mega schottky barrier recti?ers 8. test information 9. package outline fig 4. duty cycle de?nition t 1 t 2 p t 006aaa812 duty cycle d = t 1 t 2 fig 5. package outline sod123f fig 6. package outline sod323f (sc-90) fig 7. package outline sot23 (to-236ab) 04-11-29 dimensions in mm 1.2 1.0 0.25 0.10 3.6 3.4 2.7 2.5 0.55 0.35 0.70 0.55 1.7 1.5 1 2 04-09-13 dimensions in mm 0.80 0.65 0.25 0.10 0.5 0.3 2.7 2.3 1.8 1.6 0.40 0.25 1.35 1.15 1 2 04-11-04 dimensions in mm 0.45 0.15 1.9 1.1 0.9 3.0 2.8 2.5 2.1 1.4 1.2 0.48 0.38 0.15 0.09 12 3
pmeg2010eh_ej_et_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 20 march 2007 7 of 11 nxp semiconductors pmeg2010eh/ej/et 1 a very low v f mega schottky barrier recti?ers 10. packing information [1] for further information and the availability of packing methods, see section 14 . 11. soldering table 9. packing methods the indicated -xxx are the last three digits of the 12nc ordering code. [1] type number package description packing quantity 3000 10000 pmeg2010eh sod123f 4 mm pitch, 8 mm tape and reel -115 -135 pmeg2010ej sod323f 4 mm pitch, 8 mm tape and reel -115 -135 PMEG2010ET sot23 4 mm pitch, 8 mm tape and reel -215 -235 re?ow soldering is the only recommended soldering method. dimensions in mm fig 8. re?ow soldering footprint sod123f re?ow soldering is the only recommended soldering method. dimensions in mm fig 9. re?ow soldering footprint sod323f (sc-90) 1.6 1.6 2.9 4 4.4 1.1 1.2 2.1 1.1 (2 ) solder lands solder resist occupied area solder paste msa433 1.65 0.50 (2 ) 2.10 1.60 2.80 0.60 3.05 0.50 0.95 solder lands solder resist occupied area solder paste
pmeg2010eh_ej_et_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 20 march 2007 8 of 11 nxp semiconductors pmeg2010eh/ej/et 1 a very low v f mega schottky barrier recti?ers fig 10. re?ow soldering footprint sot23 (to-236ab) fig 11. wave soldering footprint sot23 (to-236ab) solder resist occupied area solder lands solder paste dimensions in mm sot023 1.00 0.60 (3x) 1.30 1 2 3 2.50 3.00 0.85 2.70 2.90 0.50 (3x) 0.60 (3x) 3.30 0.85 sot023 4.00 4.60 2.80 4.50 1.20 3.40 3 21 1.20 (2x) preferred transport direction during soldering dimensions in mm solder resist occupied area solder lands
pmeg2010eh_ej_et_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 20 march 2007 9 of 11 nxp semiconductors pmeg2010eh/ej/et 1 a very low v f mega schottky barrier recti?ers 12. revision history table 10. revision history document id release date data sheet status change notice supersedes pmeg2010eh_ej_et_4 20070320 product data sheet - pmegxx10eh_ej_ser_3 modi?cations: ? the format of this data sheet has been redesigned to comply with the new identity guidelines of nxp semiconductors. ? legal texts have been adapted to the new company name where appropriate. ? type numbers pmeg2010eh and pmeg2010ej separated from data sheet pmegxx10eh_ej_ser_3 ? type number PMEG2010ET added ? section 1.1 gener al descr iption : amended ? section 1.2 f eatures : amended ? section 1.3 applications : amended ? section 8 t est inf or mation : added ? figure 7 , 10 and 11 : added ? section 13 legal inf or mation : updated pmegxx10eh_ej_ser_3 20050411 product data sheet - pmegxx10ej_ser_2 pmegxx10ej_ser_2 20050131 product data sheet - pmegxx10ej_ser_1 pmegxx10ej_ser_1 20040907 objective data sheet - -
pmeg2010eh_ej_et_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 20 march 2007 10 of 11 nxp semiconductors pmeg2010eh/ej/et 1 a very low v f mega schottky barrier recti?ers 13. legal information 13.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .nxp .com . 13.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 13.3 disclaimers general information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .nxp .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 13.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. 14. contact information for additional information, please visit: http://www .nxp.com for sales of?ce addresses, send an email to: salesad dresses@nxp.com document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation.
nxp semiconductors pmeg2010eh/ej/et 1 a very low v f mega schottky barrier recti?ers ? nxp b.v. 2007. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 20 march 2007 document identifier: pmeg2010eh_ej_et_4 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 15. contents 1 product pro?le . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description. . . . . . . . . . . . . . . . . . . . . . 1 1.2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 quick reference data. . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 thermal characteristics. . . . . . . . . . . . . . . . . . . 4 7 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 9 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 10 packing information. . . . . . . . . . . . . . . . . . . . . . 7 11 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 13 legal information. . . . . . . . . . . . . . . . . . . . . . . 10 13.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 13.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 13.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 13.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 14 contact information. . . . . . . . . . . . . . . . . . . . . 10 15 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

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